期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2007, vol.19, no.1 2007, vol.19, no.2 2007, vol.19, no.3 2007, vol.19, no.4

题名作者出版年年卷期
Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder ballsJ. Liang; N. Dariavach; P. Callahan20072007, vol.19, no.1
Optimization of lead free solder 01005 component assemblyYueli Liu; R. Wayne Johnson20072007, vol.19, no.1
Optimization of a reflow soldering process based on the heating factorJinGang Gao; YiPing Wu; Han Ding20072007, vol.19, no.1
Process and pad design optimization for 01005 passive component surface mount assemblyYu Wang; Michael Olorunyomi; Martin Dahlberg; Zoran Djurovic; Johan Anderson; Johan Liu20072007, vol.19, no.1



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