期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志:电化学学报
收藏年代1998~2024



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2007, vol.52, no.10 2007, vol.52, no.11 2007, vol.52, no.12 2007, vol.52, no.13 2007, vol.52, no.14 2007, vol.52, no.15
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2007, vol.52, no.22 2007, vol.52, no.23 2007, vol.52, no.24 2007, vol.52, no.25 2007, vol.52, no.26 2007, vol.52, no.27
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2007, vol.53, no.1 2007, vol.53, no.2 2007, vol.53, no.3 2007, vol.53, no.4

题名作者出版年年卷期
Electrochemical determination of acidity level and dissociation of formic acid/water mixtures as solventJ. S. Jaime Ferrer; E. Couallier; M. Rakib; G. Durand20072007, vol.52, no.19
Electrochemical and ATR-FTIR study of dimethyl ether and methanol electro-oxidation on sputtered Pt electrodeYan Liu; Masashi Muraoka; Shigenori Mitsushima; Ken-Ichiro Ota; Nobuyuki Kamiya20072007, vol.52, no.19
Synthesis and electrochemical characterization of PEO-based polymer electrolytes with room temperature ionic liquidsHu Cheng; Changbao Zhu; Bin Huang; Mi Lu; Yong Yang20072007, vol.52, no.19
Evaluation of microbially influenced corrosion with electrochemical noise analysis and signal processingNikita Zaveri; Rongtao Sun; Nephi Zufelt; Anhong Zhou; YangQuan Chen20072007, vol.52, no.19
Electrocodeposition of nickel-alumina nanocomposite films under the influence of static magnetic fieldsR. Peipmann; J. Thomas; A. Bund20072007, vol.52, no.19
Characterization of the reaction environment in a filter-press redox flow reactorC. Ponce-de-Leon; G. W. Reade; I. Whyte; S. E. Male; F. C. Walsh20072007, vol.52, no.19
Study on the conductivity of recast Nafion/montmorillonite and Nafion/TiO{sub}2 composite membranesF. Mura; R. F. Silva; A. Pozio20072007, vol.52, no.19
Electrochemical dissolution of surface alloys in acids: Thermodynamic trends from first-principles calculationsJ. Greeley; J. K. Norskov20072007, vol.52, no.19
Isothermal calorimetry investigation of Li{sub}(1+x)Mn{sub}(2-y)Al{sub}zO{sub}4 spinelW. Lu; I. Belharouak; S. H. Park; Y. K. Sun; K. Amine20072007, vol.52, no.19
Copper electrodeposition on pyrolytic graphite electrodes: Effect of the copper salt on the electrodeposition processOuassim Ghodbane; Lionel Roue; Daniel Belanger20072007, vol.52, no.19
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