期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
A novel crack and delamination protection mechanism for a WLCSP using soft joint technologyMing-Chih Yew; Chien-Chia Chiu; Shu-Ming Chang; Kuo-Ning Chiang20062006, vol.18, no.3
Learning from the migration to lead-free solderRichard Ciocci; Michael Pecht20062006, vol.18, no.3
Minimizing flux spatter during lead-free reflow assemblyDeepak Manjunath; Satyanarayan Iyer; Shawn Eckel; Purushothaman Damodaran; Krishnaswami Srihari20062006, vol.18, no.3
Dissolution of stainless steels in molten lead-free soldersTadashi Takemoto; Masaharu Takemoto20062006, vol.18, no.3
Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA)D. D. Hillman; L. S. Chumbley20062006, vol.18, no.3



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