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期刊
ISSN
0946-7076
刊名
Microsystem technologies
参考译名
微系统技术:传感器,致动器与系统集成
收藏年代
1998~2024
关联期刊
参考译名
收藏年代
Journal of Information Storage and Processing Systems
存储与处理系统信息杂志
2000~2001
全部
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2006, vol.12, no.10-11
2006, vol.12, no.12
2006, vol.12, no.3
2006, vol.12, no.4
2006, vol.12, no.5
2006, vol.12, no.6
2006, vol.12, no.7
2006, vol.12, no.8
2006, vol.12, no.9
题名
作者
出版年
年卷期
Surface plasma treatments enabling low temperature direct bonding
Hubert Moriceau; Francois Rieutord; Christophe Morales; Anne Marie Charvet
2006
2006, vol.12, no.5
Effect of interfacial SiO{sub}2 thickness for low temperature O{sub}2 plasma activated wafer bonding
Benoit Olbrechts; Xuanxiong Zhang; Yannick Bertholet; Thomas Pardoen; Jean-Pierre Raskin
2006
2006, vol.12, no.5
Direct bonding with on-wafer metal interconnections
C. Jia; M. Wiemer; T. Gessner
2006
2006, vol.12, no.5
Wafer direct bonding with ambient pressure plasma activation
Markus Gabriel; Brad Johnson; Ralf Suss; Manfred Reiche; Marko Eichler
2006
2006, vol.12, no.5
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)
H. Luoto; T. Suni; M. Kulawski; K. Henttinen; H. Kattelus
2006
2006, vol.12, no.5
Bonded thick film SOI with pre-etched cavities
Tommi Suni; Kimmo Henttinen; James Dekker; Hannu Luoto; Martin Kulawski; Jari Makinen; Risto Mutikainen
2006
2006, vol.12, no.5
Discussion of tooling solutions for the direct bonding of silicon wafers
Nick Aitken; Tony Rogers
2006
2006, vol.12, no.5
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
Alexander Doll; Martin Rabold; Frank Goldschmidtboing; Peter Woias
2006
2006, vol.12, no.5
Influence of the frequency on fatigue of directly wafer-bonded silicon
Jorg Bagdahn; Michael Bernasch; Matthias Petzold
2006
2006, vol.12, no.5
Fabrication of microfluidic networks with integrated electrodes
D. C. Hermes; T. Heuser; E. J. van der Wouden; J. G. E. Gardeniers; A. van den Berg
2006
2006, vol.12, no.5
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