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期刊

ISSN	1474-0893
刊名	Global SMT & Packaging
参考译名	全球表面装配技术与包装——欧洲版
收藏年代	2004～2025

关联期刊	参考译名	收藏年代
Test	试验

全部

2004	2005	2006	2007	2008	2009
2010	2011	2012	2013	2016	2017
2018	2019	2020	2021	2022	2023
2024	2025

2005, vol.5, no.1	2005, vol.5, no.10	2005, vol.5, no.2	2005, vol.5, no.3	2005, vol.5, no.4	2005, vol.5, no.5
2005, vol.5, no.6	2005, vol.5, no.7	2005, vol.5, no.8	2005, vol.5, no.9

题名	作者	出版年	年卷期
Theory closes in on causes of tin whiskers	George Galyon; Larry Palmer; Ron Gedney	2005	2005, vol.5, no.9
Lead-free soldering for automotive applications - meeting the reliability requirement	Viktor Tiedeile; Joerg Mahrle	2005	2005, vol.5, no.9
Lead-free BGA reliability: high-speed bondtesting and brittle fracture detection	Bob Sykes	2005	2005, vol.5, no.9
Electronic equipment outlook: Not all that bad in spite of a softening economy & rising energy costs	Walt Custer	2005	2005, vol.5, no.9
Ultra-fine pitch solder pastes for flip-chip assembly applications - understanding and overcoming sub-process challenges	Steve Dowds	2005	2005, vol.5, no.9
Lead-free (LF) wave-soldering: Can (should) it be eliminated	Werner Engelmaier	2005	2005, vol.5, no.9

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