期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998~2024



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2005, vol.57, no.1 2005, vol.57, no.10 2005, vol.57, no.11 2005, vol.57, no.12 2005, vol.57, no.2 2005, vol.57, no.3
2005, vol.57, no.4 2005, vol.57, no.5 2005, vol.57, no.6 2005, vol.57, no.7 2005, vol.57, no.8 2005, vol.57, no.9

题名作者出版年年卷期
Talking with Some Directors of the U.S. National LaboratoriesKelly Roncone20052005, vol.57, no.6
The World is Flat: The Globalization of Materials R&DToni Marechaux; Warren H. Hunt, Jr.20052005, vol.57, no.6
The Drive for Further Miniaturization: Silicon NanoelectronicsN. M. Ravindra20052005, vol.57, no.6
Silicon Nanoelectronics and Beyond: An Overview and Recent DevelopmentsN. M. Ravindra; Vishal R. Mehta; Sudhakar Shet20052005, vol.57, no.6
Rapid Thermal Processing for Silicon Nanoelectronics ApplicationsA. T. Fiory20052005, vol.57, no.6
Vertically Oriented Single-Wall Carbon Nanotube/Enzyme on Silicon as Biosensor ElectrodeYubing Wang; Zafar Iqbal20052005, vol.57, no.6
Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu InterconnectsHenry Y. Lu; Haluk Balkan; K. Y. Simon Ng20052005, vol.57, no.6
Solidification Shrinkage Defects in Electronic SoldersGirish S. Wable; Srinivas Chada; Bryan Neal; Raymond A. Fournelle20052005, vol.57, no.6
The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder JointsA. U. Telang; T. R. Bieler20052005, vol.57, no.6
The Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction AnalysisSungil Cho; Jin Yu; Sung K. Kang; Da-Yuan Shih20052005, vol.57, no.6