期刊


ISSN1368-2148
刊名International Journal of Manufacturing Technology and Management
参考译名国际制造技术和管理杂志
收藏年代2000～2024



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2024

2005, vol.7, no.1 2005, vol.7, no.2-4 2005, vol.7, no.5-6

题名作者出版年年卷期
Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresawLiqun Zhu; Imin Kao20052005, vol.7, no.5-6
In-process force monitoring for precision grinding semiconductor silicon wafersJeremiah A. Couey; Eric R. Marsh; Byron R. Knapp; R. Ryan Vallance20052005, vol.7, no.5-6
A novel fixed abrasive process: chemo-mechanical grinding technologyLibo Zhou; Jun Shimizu; Hiroshi Eda20052005, vol.7, no.5-6
Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of siliconM. B. Cai; X. P. Li; M. Rahman20052005, vol.7, no.5-6
Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variablesMuthukkumar S. Kadavasal; Abhijit Chandra; Sutee Eamkajornsiri; Ashraf -F. Bastawros20052005, vol.7, no.5-6
Effects of tool stiffness and infeed scheme on planarisation (Integrated model for simulation of planarisation process)Libo Zhou; Jun Shimizu; Hiroshi Eda20052005, vol.7, no.5-6
Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisationChangxue Wang; Peter Sherman; Abhijit Chandra20052005, vol.7, no.5-6
In-situ infrared detection and heating of metallic phase of silicon during scratching testLei Dong; John A. Patten; Jimmie A. Miller20052005, vol.7, no.5-6
Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission propertiesJ. M. Zhang; J. G. Sun20052005, vol.7, no.5-6
Fabrication of pin diodes using direct-bonded silicon wafersIqbal K. Bansal; Mark Surgent20052005, vol.7, no.5-6
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