期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2005, vol.17, no.1 2005, vol.17, no.2 2005, vol.17, no.3 2005, vol.17, no.4

题名作者出版年年卷期
Modelling the effect of voids in anisotropic conductive adhesive jointsK. K. Lee; N. H. Yeung; Y. C. Chan20052005, vol.17, no.1
The effect of PCB surface finish on lead-free solder jointsSami T. Nurmi; Janne J. Sundelin; Eero O. Ristolainen; Toivo K. Lepisto20052005, vol.17, no.1
Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applicationsG. J. Jackson; M. W. Hendriksen; R. W. Kay; M. Desmulliez; R. K. Durairaj; N. N. Ekere20052005, vol.17, no.1
Microstructural features contributing to enhanced behaviour of Sn-Ag based solder jointsJ. G. Lee; K. N. Subramanian20052005, vol.17, no.1
Improving the reliability of a plastic IC package in the reflow soldering process by DOEGeun Woo Kim; Kang Yong Lee20052005, vol.17, no.1



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