期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2004, vol.4, no.1 2004, vol.4, no.10 2004, vol.4, no.2 2004, vol.4, no.3 2004, vol.4, no.4 2004, vol.4, no.5
2004, vol.4, no.6 2004, vol.4, no.7-8 2004, vol.4, no.9

题名作者出版年年卷期
BGA area array joint inspectionBob Willis20042004, vol.4, no.5
A comparative study using new diode laser technology vs existing soft beam (xenon arc lamp)Gary Goldberg20042004, vol.4, no.5
Bond integrity in hybrid circuit modulesTom Adams20042004, vol.4, no.5
Global overview: A few 'bumps' but growth continuesWalt Custer20042004, vol.4, no.5
Optimal test results and return-on-investment using AOIStefan Meissner20042004, vol.4, no.5



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