期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志：电化学学报
收藏年代1998～2024



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2004 2005 2006 2007 2008 2009
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2004, vol.49, no.11 2004, vol.49, no.12 2004, vol.49, no.13 2004, vol.49, no.14 2004, vol.49, no.15 2004, vol.49, no.16
2004, vol.49, no.17-18 2004, vol.49, no.19 2004, vol.49, no.2 2004, vol.49, no.20 2004, vol.49, no.21 2004, vol.49, no.22-23
2004, vol.49, no.24 2004, vol.49, no.25 2004, vol.49, no.26 2004, vol.49, no.27 2004, vol.49, no.28 2004, vol.49, no.3
2004, vol.49, no.4 2004, vol.49, no.5 2004, vol.49, no.6 2004, vol.49, no.7 2004, vol.49, no.8 2004, vol.49, no.9-10
2004, vol.50, no.1 2004, vol.50, no.2-3 2004, vol.50, no.4

题名作者出版年年卷期
Surface electrochemistry of UO2 in dilute alkaline hydrogen peroxide solutionsJ. S. Goldik; H. W. Nesbitt; J. J. Noel; D. W. Shoesmith20042004, vol.49, no.11
Approximate evaluation of water transport number in ion-exchange membranesC. Larchet; B. Auclair; V. Nikonenko20042004, vol.49, no.11
Zinc-rich powder coatings characterisation in artificial sea water EIS analysis of the galvanic actionH. Marchebois; M. Keddam; C. Savall; J. Bernard; S. Touzain20042004, vol.49, no.11
Transport parameters for the modelling of water transport in ionomer membranes for PEM-fuel cellsFrank Meier; Gerhart Eigenberger20042004, vol.49, no.11
Structural and optical properties of p-InP(l 0 0) anodized in halogenic acidsU. Schlierf; D. J. Lockwood; M. J. Graham; P. Schmuki20042004, vol.49, no.11
Electrochemistry of guanine and 8-oxoguanine at gold electrodesElena E. Ferapontova20042004, vol.49, no.11
Studies on the stability of the electrochemically generated Cu(III)-triglycine complexDenise Lowinsohn; Maria V. Alipazaga; Nina Coichev; Mauro Bertotti20042004, vol.49, no.11
Potentiometric properties of polypyrrole bilayersA. Alumaa; A. Hallik; U. Maeorg; V. Sammelselg; J. Tamm20042004, vol.49, no.11
Evaluation and origins of the difference between double-layer capacitance behaviour at Au-metal and oxidized Au surfacesPatrick S. Germain; Wendy G. Pell; Brian E. Conway20042004, vol.49, no.11
The influence of 2,2/-dipyridyl on non-formaldehyde electroless copper platingJun Li; Harley Hayden; Paul A. Kohl20042004, vol.49, no.11
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