期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2003, vol.125, no.1 2003, vol.125, no.2 2003, vol.125, no.3 2003, vol.125, no.4

题名作者出版年年卷期
Analysis of Substrates for Single Emitter Laser DiodesTapani M. Alander; Pekka A. Heino; Eero O. Ristolainen20032003, vol.125, no.3
Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip BypassC. B. Coetzer; J. A. Visser20032003, vol.125, no.3
Packaging of Optical MEMS DevicesYee L. Low; Ronald E. Scotti; David A. Ramsey; Cristian A. Bolle; Steven P. O'Neill; Khanh C. Nguyen20032003, vol.125, no.3
Simulation of Void Growth in Molten Solder BumpsRonald L. Panton; Jong W. Lee; Lakhi Goenka; Achyuta Achari20032003, vol.125, no.3
Modeling the Thermal Behavior of Solder Paste Inside Reflow OvensA. Tavarez; J. E. Gonzalez20032003, vol.125, no.3
Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA PackagesHasan U. Akay; Yan Liu; Mostafa Rassaian20032003, vol.125, no.3
Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal PhenomenaSreekant V. J. Narumanchi; Cristina H. Amon; Jayathi Y. Murthy20032003, vol.125, no.3
Local Heat Transfer Characteristics in Simulated Electronic ModulesSeong-Yeon Yoo; Jong-Hark Park; Min-Ho Chung20032003, vol.125, no.3
Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress IntensitiesBingzhi Su; Y. C. Lee; Martin L. Dunn20032003, vol.125, no.3
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber TechnologyRavi S. Prasher20032003, vol.125, no.3
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