期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999~2024



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2023 2024

2002, vol.14, no.1 2002, vol.14, no.2 2002, vol.14, no.3

题名作者出版年年卷期
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life testsP. Towashiraporn; G. Subbarayan; B. McLlvanie; B. C. Hunter; D. Love; B. Sullivan20022002, vol.14, no.3
Assessment of board level solder joint reliability for PBGA assemblies with lead-free soldersShi-Wei Ricky Lee; Ben Hoi Wai Lui; Y. H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap20022002, vol.14, no.3
Fatigue crack growth behavior of lead-containing and lead-free soldersY. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai20022002, vol.14, no.3
Low cycle fatigue and fatigue crack growth behavior of Sn-Ag eutectic solderC. Kanchanomai; Y. Miyashita; Y. Mutoh; S. L. Mannan20022002, vol.14, no.3
Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesL. C. Shiau; C. E. Ho; C. R. Kao20022002, vol.14, no.3
Evaluation of two novel lead-free surface finishesRichard Ludwig; Ning-Cheng Lee; Chonglun Fan; Yun Zhang20022002, vol.14, no.3
Lead-free solder process implementation for PCB assemblyPeter Collier; Vasudivan Sunappan; Arulvanan Periannan20022002, vol.14, no.3
Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal agingC. M. Lawrence Wu; M. L. Chau20022002, vol.14, no.2
Solder ball failure mechanisms in plastic ball grid array packagesC. H. Zhong; S. Yi; D. C. Whalley20022002, vol.14, no.2
Reliability of tin-lead balled BGAs soldered with lead-free solder pasteSami Tapani Nurmi; Eero Olavi Ristolainen20022002, vol.14, no.2
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