期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998~2024



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1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2024

2001, vol.53, no.1 2001, vol.53, no.10 2001, vol.53, no.11 2001, vol.53, no.12 2001, vol.53, no.2 2001, vol.53, no.3
2001, vol.53, no.4 2001, vol.53, no.5 2001, vol.53, no.6 2001, vol.53, no.7 2001, vol.53, no.8 2001, vol.53, no.9

题名作者出版年年卷期
High temperature lead-free solder for microelectronicsFrank W. Gayle et al.20012001, vol.53, no.6
Creep properties of Sn-Ag solder joints containing intermetallic particlesS. Choi; J. G. Lee; F. Guo; T. R. Bieler; K. N. Subramanian; J. P. Lucas20012001, vol.53, no.6
Pb-free solders for flip-chip interconnectsD. R. Frear; J. W. Jang; J. K. Lin; C. Zhang20012001, vol.53, no.6
Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couplesRobert A. Gagliano; Morris E. Fine20012001, vol.53, no.6
Tin pest in sn-0.5 wt.% Cu lead-free solderYoshiharu Kariya; Naomi Williams; Colin gagg; William plumbridge20012001, vol.53, no.6
Copper interconnects for semiconductor devicesSailesh M. Merchant; Seung H. Kang; Mahesh Sanganeria; Bart van schravendijk; Tom Mountsier20012001, vol.53, no.6
Chemical-mechanical planarization of Cu and TaS. V. Babu; Y. Li; A. Jindal20012001, vol.53, no.6
Advances in high-K dielectric gate materials for future ULSI devicesRajnish K. Sharma; Ashok Kumar; John M. Anthony20012001, vol.53, no.6