期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2001, vol.13, no.1 2001, vol.13, no.2 2001, vol.13, no.3

题名作者出版年年卷期
Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite soldersF. Guo; S. Choi; J. P. Lucas; K. N. Subramanian20012001, vol.13, no.1
The solvent of choiceTim Lawrence; Ian Wilding; Balvinder Chowdhary20012001, vol.13, no.1
The effects of bump height on the reliability of ACF in flip-chipC. M. L. Wu; Johan Liu; N. H. Yeung20012001, vol.13, no.1
Design, Coordination and control of hybrid factories: Research issues from an exploratory field studyKen Doerr; Michael J. Magazine20012001, vol.13, no.1
Tin pest in lead-free soldersYoshiharu Kariya; Colin Gagg; William; J. Plumbridge20012001, vol.13, no.1



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