期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志：电化学学报
收藏年代1998～2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2001, vol.46, no.10-11 2001, vol.46, no.12 2001, vol.46, no.13-14 2001, vol.46, no.15 2001, vol.46, no.16 2001, vol.46, no.17
2001, vol.46, no.18 2001, vol.46, no.19 2001, vol.46, no.20-21 2001, vol.46, no.22 2001, vol.46, no.23 2001, vol.46, no.24-25
2001, vol.46, no.26-27 2001, vol.46, no.28 2001, vol.46, no.6 2001, vol.46, no.7 2001, vol.46, no.8 2001, vol.46, no.9
2001, vol.46. no.13-14 2001, vol.47, no.1-2 2001, vol.47, no.3 2001, vol.47, no.4 2001, vol.47, no.5 2001, vol.47, no.6

题名作者出版年年卷期
Principles of electrochemical micro- and nano-system technologiesJoachim Walter Schultze; Arnd Bressel20012001, vol.47, no.1-2
Introduction of electrochemical microsystem technologies (EMT) from ultra-high-density magnetic recordingTetsuya Osaka20012001, vol.47, no.1-2
Hydrodynamic ultramicroelectrodes: kinetic and analytical applicationsJulie V. Macpherson; Nafeesa Simjee; Patrick R. Unwin20012001, vol.47, no.1-2
Molecular orbital study on the reaction mechanisms of electroless deposition processesTakayuki Homma; Isao Komatsu; Amiko Tamaki; Hiromi Nakai; Tetsuya Osaka20012001, vol.47, no.1-2
Material characterisation of electroplated nickel structures for microsystem technologyT. Fritz; W. Mokwa; U. Schnakenberg20012001, vol.47, no.1-2
Pulse reversal plating of nickel and nickel alloys for microgalvanicsPeter T. Tang20012001, vol.47, no.1-2
Microstructure in electrodeposited copper layers: the role of the substrateAnette A. Rasmussen; Jens A. D. Jensen; Andy Horsewell; Marcel A. J. Somers20012001, vol.47, no.1-2
Plating technology for electronics packagingHideo Honma20012001, vol.47, no.1-2
Via-filling using electroplating for build-up PCBsTakeshi Kobayashi; Junichi Kawasaki; Kuniaki Mihara; Hideo Honma20012001, vol.47, no.1-2
Optimisation of a cupplater reactor for gold deposition on wafersD. de Kubber; L. Bortels; J. Deconinck; T. E. G. Daenen20012001, vol.47, no.1-2
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