期刊


ISSN0020-2967
刊名Transactions of the Institute of Metal Finishing
参考译名金属精饰学会汇刊
收藏年代1998～2024



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2004 2005 2006 2007 2008 2009
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2000, vol.78, no.1 2000, vol.78, no.2 2000, vol.78, no.3 2000, vol.78, part.4 2000, vol.78, part.5 2000, vol.78, part.6

题名作者出版年年卷期
Acid copper plating with insoluble anodes - a novel technology in PCB manufacturingJurgen Barthelmes20002000, vol.78, part.4
An ac-impedance study of oxygen reduction on a platinum-dispersed porous carbon electrodeA. Hannani; K. Belmokre20002000, vol.78, part.4
Aqueous-based cleaning of components intended for service in oxygen enriched atmospheres - introduction and reviewA. F. Averill; J. M. Ingram; P. F. Nolan20002000, vol.78, part.4
Developments in low friction wear resistant coatings deposited by closed field unbalanced magnetron sputter ion platingVanessa Fox20002000, vol.78, part.4
Electrochemical measurements of electroless nickel coatings on zincated aluminium substratesS. W. Court; B. D. Barker; F. C. Walsh20002000, vol.78, part.4
Electrodeposited copper foil for fine patternTadao Nakaoka20002000, vol.78, part.4
Improvement of adhesion for layer-to-layer connection for build-up printed circuit boardsHideo Honma; Junichi Ishibashi; Takeshi Kobayashi; Hiroki Irisawa20002000, vol.78, part.4
Morphology and composition of electrodeposited CoMn layersM. Nikolova; N. Atanassov; J. Fischer Buhner; A. Zielonka20002000, vol.78, part.4
Structure and constitution of zinc-cobalt electrodepositsD. E. O. S. Carpenter; S. D. Carpenter; J. P. G. Farr20002000, vol.78, part.4
Surface finishes for advanced PWBS using COB, BGA, CSP and fine pitch SMDSBernd Guenther20002000, vol.78, part.4
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