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1998, vol.89, no.1	1998, vol.89, no.10	1998, vol.89, no.11	1998, vol.89, no.12	1998, vol.89, no.2	1998, vol.89, no.3
1998, vol.89, no.4	1998, vol.89, no.5	1998, vol.89, no.6	1998, vol.89, no.7	1998, vol.89, no.8	1998, vol.89, no.9

题名	作者	出版年	年卷期
Internal coating of aluminium cylinder bores using PVD (part 2)	Lugscheider, E.; Wolff, Ch.	1998	1998, vol.89, no.8
Non-destructive and contactless characterisation of coatings using microwaves	Sklarczyk, C.	1998	1998, vol.89, no.8
Organic circuit board substrates with solder deposits for flip-chip assembly	Maiwald, W. J.	1998	1998, vol.89, no.8
Organic metals: a new class of material for electronics, corrosion protections and... part 2: a revolutionary, efficient corrosion protection technology	Wessling, B.	1998	1998, vol.89, no.8
Prevention in electroplating. Part 4	Feilke, H.	1998	1998, vol.89, no.8
Recycling of sludges from vibratory finishing and spent media or chips	Lohnert, V.	1998	1998, vol.89, no.8
Rinsing -- theoretical basis and calculations for rinsing systems. Part 5: calculations of change of concentration during a rinse cycle	Kubik, C.	1998	1998, vol.89, no.8
Studies on the corrosion behaviour of magnesium after oxygen ion implantation	Schneider, M.; Nocke, K.; Richter, E.	1998	1998, vol.89, no.8
Wire bonding -- what is bondability?	Berchtold, L.	1998	1998, vol.89, no.8