期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1996, vol.118, no.1 1996, vol.118, no.2 1996, vol.118, no.3 1996, vol.118, no.4

题名作者出版年年卷期
A model for deformation of solder bumps from ramp loadingLewis S. Goldmann19961996, vol.118, no.1
Comparison of the cooling performance of staggered and in-line arrays of electronic packagesR. A. Wirtz; D. M. Colban19961996, vol.118, no.1
Controlling the dimensions of laser chemical vapor deposited metallurgyL. Economikos; D. E. Kotecki; R. Surprenant19961996, vol.118, no.1
Fine pitch stencil printing process modeling and optimizationY. Li; R. L. Mahajan; N. Nikmanesh19961996, vol.118, no.1
Heat transfer from an array of strips to fluorinert coolant in a mixed impinging-jet/channel-flow configurationWataru Nakayama; Masud Behnia; Hiroaki Mishima; Hua Sun19961996, vol.118, no.1
PCB layout design using a genetic algorithmSakait Jain; Hae Chang Gea19961996, vol.118, no.1
Single-phase and boiling cooling of small pin fin arrays by multiple nozzle jet impingementDavid Copeland19961996, vol.118, no.1
Statistical model for the inherent tilt of flip-chipsLewis S. Goldmann19961996, vol.118, no.1



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