期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
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1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
A global sensitivity approach for the dynamic response of printed wiring boardsH. Jensen; A. O. Cifuentes19951995, vol.117, no.1
An approximate method for predicting laminar heat transfer between parallel plates having embedded heat sourcesR. S. Figliola; P. G. Thomas19951995, vol.117, no.1
Contact analysis of regular patterned rough surfaces in magnetic recordingBharat Bhushan; Xuefeng Tian19951995, vol.117, no.1
Fatigue of microlithographically-patterned free-standing aluminum thin film under axial stressesDavid T. Read; James W. Dally19951995, vol.117, no.1
Forced convective cooling enhancement through a double layer designB. T. F. Chung; H. H. Li19951995, vol.117, no.1
How compliant should a die-attachment be to protect the chip from substrate bowing?E. Suhir19951995, vol.117, no.1
Laminar heat transfer between a series of parallel plates with surface-mounted discrete heat sourcesS. H. Kim; N. K. Anand19951995, vol.117, no.1
Numerical study of forced convection in a partially porous channel with discrete heat sourcesH. A. Hadim; A. Bethancourt19951995, vol.117, no.1
On the natural convection in cavity with a cooled top wall and multiple protruding heatersC. P. Desai; K. Vafai; M. Keyhani19951995, vol.117, no.1
Steady-state investigation of vapor deposited micro heat pipe arraysA. K. Mallik; G. P. Peterson19951995, vol.117, no.1
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