Comparative experimental study of heat sinks with piezoelectric pump
参考中译:压电泵散热器的对比实验研究


          

刊名：Applied Thermal Engineering
作者：Jun Huang（Research Center of Fluid Machinery Engineering and Technology, Jiangsu University）
Linjiao Li（Research Center of Fluid Machinery Engineering and Technology, Jiangsu University）
Xingang Cong（Research Center of Fluid Machinery Engineering and Technology, Jiangsu University）
Guiping Zhu（College of Astronautics, Nanjing University of Aeronautics and Astronautics）
Hiba Affane（Research Center of Fluid Machinery Engineering and Technology, Jiangsu University）
Quan Zhang（School of Mechatronic Engineering and Automation, Shanghai University）
Yuan Wang（College of Communication Engineering, Army Engineering University of PLA）
刊号：725C0058
ISSN：1359-4311
出版年：2023
年卷期：2023, vol.219, no.Pt.B
页码：119612-1--119612-13
总页数：13
分类号：TK12
关键词：Cooling；Heat transfer；Micro-channel structure；Pressure drop；Umbrella valve；Y-shaped bifurcation
参考中译：冷却；换热；微通道结构；压降；伞阀；Y形分叉
语种：eng
文摘：How to effectively cool highly integrated electronic devices is a hot and challenging research problem. To improve the cooling performance of microchannel systems, a new piezoelectric pump-based cooling system is proposed in the paper, which includes a piezoelectric pump with umbrella-shaped valves and microchannel-based heat sinks. We theoretically analyzed the effects of flow rates and heat transfer coefficients on the cooling performance when using four different types of microchannel-based heat sinks. Then, the piezoelectric pump and those heat sinks were fabricated, and the maximum output flow rate was experimentally measured. A CPU with a fixed power input was chosen to experimentally access the overall heat transfer coefficient of the heat sinks. The theoretical and experimental results revealed that the cooling performance of the proposed system was related to both the output flow rate and the overall heat transfer coefficient of the heat sinks. At last, we demonstrated that the piezoelectric cooling system, equipped with the heat sink of the tandem Y-shape bifurcation microchannel, had the best cooling performance: the CPU temperature was stabilized within 60.6℃ when the working power of the CPU was fixed at 30 W, resulting in a cooling efficiency up to 51.12%.
参考中译：如何有效地冷却高度集成的电子设备是一个热点和具有挑战性的研究问题。为了提高微通道系统的冷却性能，本文提出了一种新型的基于压电泵的微通道冷却系统，该系统包括伞形阀压电泵和基于微通道的散热器。从理论上分析了采用四种不同类型的微通道散热器时，流量和换热系数对散热性能的影响。然后，制作了压电泵及其散热器，并对其最大输出流量进行了实验测量。实验中选择了具有固定功率输入的CPU来获取散热器的总换热系数。理论和实验结果表明，该系统的冷却性能与散热器的输出流量和总的换热系数有关。结果表明，采用串联Y型分叉微通道散热片的压电式制冷系统具有最佳的制冷性能：当中央处理器的工作功率固定在30W时，中央处理器的温度稳定在60.6℃以内，制冷效率高达51.12%。



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